Vertically die-stacked bonder and method using the same

ABSTRACT

A vertically die-stacked bonder able to stack laterally dies one by one includes a self-elevating unit, a retrieval unit neighbored to the self-elevating unit, and a receiving unit neighbored to the retrieval unit. At least one die is located at the self-elevating unit. The self-elevating unit elevates one die by 90 degrees, so as to form a vertical state. The retrieval unit hands over the die in the vertical state to the receiving unit. The self-elevating unit then elevates another die by 90 degrees once again. The retrieval unit stacks laterally the another die in the vertical state to the previous die at the receiving unit. Thereupon, by stacking laterally the dies in the vertical state orderly, the speed of die stacking can be increased, the production costs can be reduced, and the productivity can be increased.

This application claims the benefit of Taiwan Patent Application SerialNo. 106114523, filed May 2, 2017, the subject matter of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION (1) Field of the Invention

The invention relates to a vertically die-stacked bonder and a methodusing the same, and more particularly to the vertically die-stackedbonder and the method using the vertically die-stacked bonder that canelevate the die elevate by 90 degrees so as to achieve a vertical stateof die, such that a plurality of dies can be orderly and laterallystacked together. Thereupon, the stacking efficiency of the dies can beenhanced, the production speed can be increased, and the production costcan be reduced.

(2) Description of the Prior Art

Recently, one of mainstream technology in the semiconductor industry isto chase multi-functions, high-capacity, compactness and minimization.For example, the stacked package on package (PoP) is a technology thatinvolves die stacking and package stacking. In order to increase theline density of the semiconductor component but decrease the packagevolume thereof, the PoP usually adopts a 3-dimensional vertical stackingfor the entire integration.

Currently, the 3-dimensional vertical stacking is to stack together aplurality of stack-able semiconductor packages, so as to form a PoPmodule.

However, at least three shortcomings exist in the aforesaid3-dimensional vertical stacking. One of these shortcomings is the lowproduction speed, another thereof is the high production cost, and thethird thereof is the poor binding rate between semiconductors. Thereby,the number of stacking layers would be limited. Obviously, animprovement upon the packaging technique or the 3-dimensional stackingwould be definitely welcome to the art.

SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to provide avertically die-stacked bonder and a method using the verticallydie-stacked bonder that can produce a vertical state of dies byelevating each of the dies by 90 degrees and then stack the dies orderlyand laterally, such that the production speed can be enhanced, theproduction cost can be reduced, the maximum number of stack-able dielayers can be increased, and the binding of the dies can bestrengthened.

In the present invention, the vertically die-stacked bonder includes:

a self-elevating unit;

a retrieval unit, neighbored to the self-elevating unit; and

a receiving unit, neighbored to the retrieval unit;

wherein at least one die is located at the self-elevating unit, theself-elevating unit elevates one of the at least one die by 90 degreesso as to have the die into a vertical state, the retrieval unit movesthe die in the vertical state to the receiving unit, the self-elevatingunit elevates again another one of the at least one die by 90 degrees soas to have this another one die into the vertical state, and theretrieval unit stacks laterally this another one die in the verticalstate to the die already in the vertical state at the receiving unit.

In another aspect of the present invention, the vertically die-stackedmethod includes the steps of:

(a) elevating a die by 90 degrees so as to have the die into a verticalstate;

(b) sucking the die in the vertical state by a retrieval unit, andmoving the die to a receiving unit;

(c) placing the die to the receiving unit by the retrieval unit;

(d) elevating another die by 90 degrees so as to have the another dieinto the vertical state;

(e) sucking the another die in the vertical state by the retrieval unit,and moving the another die to the receiving unit having the die; and

(f) stacking laterally the another die in the vertical state to the diealready at the receiving unit.

In one embodiment of the present invention, a first vision unit isincluded to capture image information of the receiving unit, andprovides the image information to the retrieval unit and the receivingunit; wherein, in the step (c), the receiving unit bases on the imageinformation from the first vision unit to adjust a position of thereceiving unit with respect to the retrieval unit having the die;wherein, if the receiving unit is confirmed that the die can be placedto the receiving unit, the receiving unit moves laterally to place oradhere the die to the receiving unit; wherein the first vision unit isable to align the dies of the receiving unit and the retrieval unitsimultaneously or individually.

In one embodiment of the present invention, a first vision unit isincluded to capture image information of the another die at thereceiving unit, and provides the image information to the receiving unitand the retrieval unit; wherein, in the step (f), the receiving unitbases on the image information from the first vision unit to adjust aposition of the die at the receiving unit with respect to the anotherdie at the retrieval unit; wherein, if the another die at the retrievalunit is able to stack the another die to the die at the receiving unit,the receiving unit moves laterally so as to have the another die at theretrieval unit to stack laterally onto the die already at the receivingunit; wherein the first vision unit aligns the die at the receiving unitto the another die at the retrieval unit.

As stated above, the vertically die-stacked bonder and the method usingthe same of the present invention are to elevate the die by 90 degreesso as to set the die in the vertical state, and then to stack laterallythe dies in the vertical state orderly, such that the stacking speed ofthe dies can be increased, the production cost can be reduced, and theproductivity can be enhanced. Also, the number of die-stacked layers canbe increased.

All these objects are achieved by the vertically die-stacked bonder andthe method using the same described below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will now be specified with reference to itspreferred embodiment illustrated in the drawings, in which:

FIG. 1 is a schematic view of a first embodiment of the verticallydie-stacked bonder in accordance with the present invention;

FIG. 2 is another schematic view of the first embodiment of thevertically die-stacked bonder in accordance with the present invention;

FIG. 3 is a schematic view of a second embodiment of the verticallydie-stacked bonder in accordance with the present invention; and

FIG. 4 is a flowchart of a preferred method using a verticallydie-stacking binder in accordance with the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The invention disclosed herein is directed to a vertically die-stackedbonder and a method using the same. In the following description,numerous details are set forth in order to provide a thoroughunderstanding of the present invention. It will be appreciated by oneskilled in the art that variations of these specific details arepossible while still achieving the results of the present invention. Inother instance, well-known components are not described in detail inorder not to unnecessarily obscure the present invention.

Referring now to FIG. 1, a schematic view of a first embodiment of thevertically die-stacked bonder in accordance with the present inventionis shown. The vertically die-stacked bonder includes a self-elevatingunit 10, a retrieval unit 11, a receiving unit 12, a first vision unit13, a second vision unit 14, a supply unit 16 and a third vision unit17.

The self-elevating unit 10 has a self-elevating carrier 100 and aself-elevating displacement module 101, in which the self-elevatingdisplacement module 101 is coupled with the self-elevating carrier 100.

The retrieval unit 11 neighbored to the self-elevating unit 10 has atleast two sucking modules 110 and a rotational retrieval module 111, inwhich the sucking modules 110 are individually mounted to the rotationalretrieval module 111.

The receiving unit 12 neighbors to the retrieval unit 11 has a receivingcarrier 120 and a receiving displacement module 121, in which thereceiving carrier 120 is located on the receiving displacement module121.

The first vision unit 13 is located under the retrieval unit 11 at aposition respective to the receiving carrier 120.

The second vision unit 14 is located above the self-elevating unit 10.

The supply unit 16 neighbored to the self-elevating unit 10 has at leastone supply-suck module 160, a carrier 161 and at least one ejection pin162, in which the carrier 161 is to mount thereon at least one die 15,the ejection pin 162 is mounted inside the carrier 161 so as to ejectthe die 15 placed on the carrier 161, and the supply-suck module 160 islocated above the carrier 161 so as to suck the die 15 on the carrier161 and then displace the die 15 to the self-elevating unit 10.

The third vision unit 17 is located above the carrier 161.

Referring now to FIG. 3, a schematic view of a second embodiment of thevertically die-stacked bonder in accordance with the present inventionis shown. The vertically die-stacked bonder includes a self-elevatingunit 20, a retrieval unit 21, a receiving unit 22, a first vision unit23, a second vision unit 24, a supply unit 26 and a third vision unit27.

In this second embodiment, the self-elevating unit 20, the retrievalunit 21, the receiving unit 22, the second vision unit 24, the supplyunit 26 and the third vision unit 27 are the same to those in the firstembodiment, and thus details thereabout are omitted herein.

The first vision unit 23 has a lens module 230 and an image-capturingmodule 231, in which the lens module 230 is located under the retrievalunit 21 at a position facing the receiving carrier 220, and theimage-capturing module 231 is located above the retrieval unit 21 at aplace opposing to the lens module 230 with respect to the retrieval unit21.

Referring now to FIG. 4, a flowchart of a preferred method using avertically die-stacking binder in accordance with the present inventionis shown. The method includes the following steps.

Step S1: Provide a die, as shown in FIG. 1. The third vision unit 17captures image information of the die 15 on the carrier 161, and thenthe image information is further transmitted to the supply-suck module160 and the ejection pin 162. According to the image information, theejection pin 162 is to eject the specific die 15. Also, according to theimage information, the supply-suck module 160 sucks the ejected die 15,and then the sucked die 15 is moved and placed on the self-elevatingcarrier 100 by the supply-suck module 160.

Step S2: Elevate the die into a vertical state. As shown in FIG. 2, theat least one die 15 is placed on the self-elevating carrier 100. Theself-elevating displacement module 101 is to elevate the self-elevatingcarrier 100 by 90 degrees with respect to the self-elevatingdisplacement module 101 and parallel to the sucking module 110. When theself-elevating carrier 100 is elevated by 90 degrees, the die 15 on theself-elevating carrier 100 is also elevated by 90 degrees into thevertical state.

Step S3: Suck the die in the vertical state by the retrieval unit. Thesecond vision unit 14 captures image information of the dies 15 on theself-elevating carrier 100, and then the image information istransmitted to the self-elevating displacement module 101 forcompensating the position, such that the retrieval unit 11 canaccurately fetch, by sucking, the die 15 that has been compensated inpositioning and elevated into the vertical state. Then, the rotationalretrieval module 111 rotates the sucking module 110 (having the die 15already) to a position of the receiving unit 12.

As shown in FIG. 2, the first vision unit 13 captures an image of thereceiving carrier 120, and then provides the corresponding imageinformation to the retrieval unit 11 and the receiving unit 12.

In addition, the first vision unit 13 can simultaneously or individuallyalign the receiving carrier 120 and the die 15 at the retrieval unit 11.

Referring now to FIG. 3, in this embodiment, the image-capturing module231 captures the image information in the lens module 230, in which theimage information is the image information of the die 25 at thereceiving carrier 220 or the retrieval unit 21.

Step S4: Place the die to the receiving unit. As shown in FIG. 2, thereceiving unit 12 receives the image information from the first visionunit 13 so as to allow the receiving displacement module 121 to adjustthe position of the receiving carrier 120 with respect to the suckingmodule 110 having the die 15. The receiving displacement module 121 islaterally moved so as to have the die 15 able to be placed or adhered tothe receiving carrier 120.

As shown in FIG. 3, the retrieval unit 21 receives the image informationfrom the image-capturing module 231 of the first vision unit 23, andthen the receiving unit 22 moves laterally so as to have the die 25 ofthe retrieval unit 21 able to be placed or adhered to the receivingcarrier 220.

Step S5: Elevate another die into the vertical state. The self-elevatingcarrier 100 elevates this another die 15 and turns this die 15 into thevertical state. Similar to Step S1, the supply unit 16 provides this die15 to the self-elevating carrier 100 again. Also, similar to Step S2,the second vision unit 14 captures the image information of the anotherdie 15, and then transmits the image information to the retrieval unit11.

Step S6: Suck this another die in the vertical state by the retrievalunit. Similar to Step S3, the self-elevating unit 10 compensates theposition with respect to the retrieval unit 11 so as to allow theretrieval unit 11 to fetch this another die 15 in the vertical stateprecisely. The retrieval unit 11 receives the image information from thesecond vision unit 14, and allows the sucking module 110 to fetch, bysucking, this another die 15 on the self-elevating carrier 100. Thesucking module 110 having this another die 15 is then rotated by therotational retrieval module 111 to match the position of the receivingunit 12.

As shown in FIG. 2, the first vision unit 13 captures the imageinformation of the die 15 on the receiving carrier 120, and thenprovides the image information top the retrieval unit 11 and thereceiving unit 12.

Further, the first vision unit 13 captures the image information fromthe receiving carrier 120 or the existing image information of the die15, and then provides the image information top the retrieval unit 11and the receiving unit 12.

In addition, the first vision unit 13 can align the die 15 of thereceiving carrier 120 and the die 15 of the retrieval unit 11simultaneously.

As shown in FIG. 3, the image-capturing module 231 is to capture theimage information from the lens module 230, which is the imageinformation of the die 25 on the receiving carrier 220.

Step S7: Stack laterally this another die in the vertical state to thedie already at the receiving unit. As shown in FIG. 1, similar to StepS4, the receiving unit 12 receives the image information from the firstvision unit 13. If the die 15 already at the receiving unit 12 is notaligned with the another die 15 at the retrieval unit 11, then thereceiving unit 12 would adjust its own position till the another die 15at the retrieval unit 11 can match laterally the die 15 at the receivingunit 12. The receiving displacement module 121 moves laterally so as toallow the another die 15 to be placed or adhered to the die 15 alreadyat the receiving unit 12.

If the image information received by the receiving unit 12 from thefirst vision unit 13 matches the precise position for stacking the die15 onto the receiving unit 12, then the receiving unit 12 would not needany position adjustment. The receiving displacement module 121 moveslaterally so as to have the another die 15 to be placed or adhered tothe die 15 already at the receiving unit 12.

If the number of the dies 15 stacked at the receiving carrier 120 hasreached a predetermined amount, then the method is stopped.

If the number of the dies 15 stacked at the receiving carrier 120 hasnot yet reached the predetermined amount, then go back to perform StepS5.

In summary, the vertically die-stacked bonder and the method using thesame of the present invention are to elevate the die by 90 degrees so asto set the die in the vertical state, and then to stack laterally thedies in the vertical state orderly, such that the stacking speed of thedies can be increased, the production cost can be reduced, and theproductivity can be enhanced.

In addition, the self-elevating unit can adjust the position withrespect to the retrieval unit, so that the self-elevating unit can beaccurately aligned with the retrieval unit, and thus the die can beplaced to the predetermined position at the retrieval unit.

While the present invention has been particularly shown and describedwith reference to a preferred embodiment, it will be understood by thoseskilled in the art that various changes in form and detail may bewithout departing from the spirit and scope of the present invention.

What is claimed is:
 1. A vertically die-stacked bonder, comprising: aself-elevating unit; a retrieval unit, neighbored to the self-elevatingunit; and a receiving unit, neighbored to the retrieval unit; wherein atleast one die is located at the self-elevating unit, the self-elevatingunit elevates one of the at least one die by 90 degrees so as to havethe die into a vertical state, the retrieval unit moves the die in thevertical state to the receiving unit, the self-elevating unit elevatesagain another one of the at least one die by 90 degrees so as to havethis another one die into the vertical state, and the retrieval unitstacks laterally this another one die in the vertical state to the diealready in the vertical state at the receiving unit.
 2. The verticallydie-stacked bonder of claim 1, wherein the self-elevating unit has aself-elevating carrier and a self-elevating displacement module couplingthe self-elevating carrier.
 3. The vertically die-stacked bonder ofclaim 1, wherein the retrieval unit has at least two sucking modules anda rotational retrieval module, the at least two sucking modules beingmounted at the rotational retrieval module.
 4. The verticallydie-stacked bonder of claim 1, wherein the receiving unit has areceiving carrier and a receiving displacement module, the receivingcarrier being located at the receiving displacement module.
 5. Thevertically die-stacked bonder of claim 4, further including a firstvision unit, the first vision unit being located under the retrievalunit and respective to the receiving carrier.
 6. The verticallydie-stacked bonder of claim 5, wherein the first vision unit aligns thedie of the receiving carrier and the die of the retrieval unit.
 7. Thevertically die-stacked bonder of claim 4, further including a firstvision unit, the first vision unit has an image-capturing module and alens module, the lens module being located under the retrieval unit andrespective to the receiving carrier, the image-capturing module beinglocated above the retrieval unit and respective to the lens module. 8.The vertically die-stacked bonder of claim 7, wherein the first visionunit aligns the die of the receiving carrier and the die of theretrieval unit.
 9. The vertically die-stacked bonder of claim 1, furtherincluding a second vision unit, the second vision unit being locatedabove the self-elevating unit.
 10. The vertically die-stacked bonder ofclaim 1, further including a supply unit and a third vision unit, thesupply unit being neighbored to the self-elevating unit, the thirdvision unit being located above the supply unit.
 11. The verticallydie-stacked bonder of claim 10, wherein the supply unit has a carrier,at least one ejection pin and at least one supply-suck module, thecarrier being neighbored to the self-elevating unit, the ejection pinbeing located in the carrier, the supply-suck module being located abovethe carrier.
 12. A vertically die-stacked method, comprising the stepsof: (a) elevating a die by 90 degrees so as to have the die into avertical state; (b) sucking the die in the vertical state by a retrievalunit, and moving the die to a receiving unit; (c) placing the die to thereceiving unit by the retrieval unit; (d) elevating another die by 90degrees so as to have the another die into the vertical state; (e)sucking the another die in the vertical state by the retrieval unit, andmoving the another die to the receiving unit having the die; and (f)stacking laterally the another die in the vertical state to the diealready at the receiving unit.
 13. The vertically die-stacked method ofclaim 12, wherein, in the step (f), if a number of the dies stacked atthe receiving unit has reached a predetermined amount, then the methodis stopped; and, if the number of the dies stacked at the receiving unithas not yet reached the predetermined amount, then go back to performthe step (d).
 14. The vertically die-stacked method of claim 12,wherein, in the step (a), the die is located at a self-elevating carrierof a self-elevating unit, the self-elevating carrier is to elevate 90degrees so as to have the die elevated by 90 degrees.
 15. The verticallydie-stacked method of claim 12, wherein, in the step (b), a first visionunit captures image information of the receiving unit, and provides theimage information to the retrieval unit and the receiving unit; wherein,in the step (c), the receiving unit bases on the image information fromthe first vision unit to adjust a position of the receiving unit withrespect to the retrieval unit having the die; wherein, if the receivingunit is confirmed that the die can be placed to the receiving unit, thereceiving unit moves laterally to place or adhere the die to thereceiving unit; wherein the first vision unit is able to align the diesof the receiving unit and the retrieval unit simultaneously orindividually.
 16. The vertically die-stacked method of claim 12,wherein, in the step (e), a first vision unit captures image informationof the another die at the receiving unit, and provides the imageinformation to the receiving unit and the retrieval unit; wherein, inthe step (f), the receiving unit bases on the image information from thefirst vision unit to adjust a position of the die at the receiving unitwith respect to the another die at the retrieval unit; wherein, if theanother die at the retrieval unit is able to stack the another die tothe die at the receiving unit, the receiving unit moves laterally so asto have the another die at the retrieval unit to stack laterally ontothe die already at the receiving unit; wherein the first vision unitaligns the die at the receiving unit to the another die at the retrievalunit.
 17. The vertically die-stacked method of claim 12, wherein, in thestep (e), a second vision unit captures image information of the anotherdie at the self-elevating unit, and provides the image information tothe self-elevating unit first position compensation, such that theretrieval unit sucks the another die been compensated in position andalready been elevated.
 18. The vertically die-stacked method of claim14, further including a step of a supply unit providing the die to theself-elevating carrier.
 19. The vertically die-stacked method of claim18, wherein the supply unit has a carrier, at least one ejection pin andat least one supply-suck module, the ejection pin being located in thecarrier, the carrier mounting at least one die, a third vision unitcapturing the image information of the die at the carrier so as toprovide the image information to the ejection pin and the supply-suckmodule, the ejection pin basing on the image information to eject aspecific die, the supply-suck module basing on the image information tosuck the specific die and place the die to the self-elevating unit viathe carrier.